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Substrate for Wafer UV Tape
Substrate for Wafer UV  Tape

Characteristic


Excellent flatness
Surface tension and thickness uniformity
Low gel


Application


Substrate for wafer UV tape
Lid film for wafer box protection


Sizes
&
Materials


Thickness : 50 ~ 200 µm
Max width : 1300 mm
Material: polyolefin
Customized designs are welcome